Reflow Oven = Vitronics MR 9339 – Zone Top & Bottom with 3 cooling Zone Lead Free.
SGS Tekniks SMT Manufacturing capability includes 16 MIL, Chip 0201, BGA & micro BGA. Our SMT manufacturing capacity is 60000 CPH.
Every customised assemblies would be built in accordance with IPC – 610C Standard if the assembly is nonleadfree & IPC 610D standard if the assembly is lead free. This would be done in a timly fashion, then packed & shipped in accordance with customer preference.
Plated Through Hole
Wave Soldering Machine
Wave Soldering Machine (Lead Free)
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We have automated conveyorised workcentre for leaded component insertion. PCB’s are automatically placed for each operation in a timely manner allowing insertion & inspection prior to the next operation. Soldering can be facilated either using TMPL dual wave soldering machine for non lead free assembly and Electrovert dual wave soldering machine for lead free assemblies while maintaining standard IPC 610C & IPC 610D respectively.
Our soldering processes are optimised to handle complex printed circuit boards as well as the need to eliminate CFC cleaning.
Box Assembly
For customer's who require complete turnkey box build, SGS Tekniks will package the product as per customer's ready configuration
SGS Tekniks is specialized to give complete box assembly solution to end customers. We are specialized in sourcing plastic or sheet metal housing required for your product.
SGS Tekniks is focused on design & development of housing based on customised model.
“Leave your product manufacturing to trusted EMS Provider , thus reducing your operation cost & time”.
Box Build Assembly
In addition to design & assembly services, SGS Tekniks provides complete box build manufacturing solutions including sourcing of all components, plastic & metal housing, print & packaging material.