Solder Paste Inspection (SPI)


In any Electronic Assembly one of the prime reasons for post SMD assembly failures is perhaps Dry Solder / No Solder. Avoidance of these would result in higher yield (lower rejection PPM) thereby increasing productivity & profitability

In an SMT line, in-line SPI with 3D viewing facility will augment your process perfection in combination with the Automatic Optical Inspection which will facilitate detection and elimination of soldering failures. We will be able to measure volume, height, thickness, paste bridging etc. and compare with the prescribed values for a particular assembly. This will completely avoid replacement of components post solder due to dry or no solder thereby eliminating extra production costs. Other benefits are Process control through feed back to paste printer and control of stencil cleaning cycle.

We at SGS Tekniks have implemented 3D In-Line Solder Paste Inspection in our SMT line at our Manesar plant to perfect the process of soldering.